header
VLSI-SOC 2008 Registration

On-line Registration and payment is preferred. Your registration payment will be processed through a secure web-based credit card payment system (SSL encrypted data transfer). All registrations will be handled by Ms. Stamatia Gika of MeetingPlanner.gr (the Conference’s management company).

You may proceed with registering on-line at the end of this page. Before you proceed with submitting your registration please carefully read the following information on registration methods, payment and cancellation policies.

Registration Fees

(in Euro)

Author-Presenter

by July 25, 2008

Early

by September 7, 2008

Late / On-Site

After September 7, 2008

IFIP/IEEE/ACM Member

490

490

600

Non Member

620

620

720

Student Member

380

380

480

Student Non-Member

440

440

550

 All types of registration fees include:

Admission to all Conference sessions

Conference proceedings

Coffee breaks

Lunches

Conference Banquet

Optional Additional Items (in Euro)

Please make sure that you only purchase if required. The following items are included in your registration fee.

Extra page charge
(each page after 4th or 6th )

100

 

Conference proceedings
(hard copy +CD)

70

 

Banquet Ticket

(Tuesday, October 14th )

70

 

Lunch Ticket (daily)

30

 

 Registration Information & Notes for Authors

For each accepted paper to be included in the Conference proceedings, at least one author must register by July 25, 2008, at the IFIP/IEEE/ACM Member or  Non-Member, or  Student or Student Non-Member rate and present the paper at the conference.

Each page after the 6th for oral paper and 4th page for poster paper is charged €100 and should be purchased as an additional item. No paper should exceed 8 pages in length.

Non-author or author-non-presenter participants, to be eligible for the early registration fee, payment of registration must have been received by September 7, 2008. Registration payments after that date will be charged with the late registration fee.

IEEE/IFIP/ACM Member rates are only available to individuals who are IEEE/IFIP/ACM members at the time of registration - visit www.ieee.org/join, www.acm.org to join. IEEE members should provide their Member No (in the registration form) and be prepared to show their IEEE membership card at the conference registration desk.

Students must be prepared to show their student card or any document certifying their student status.

The conference organization can issue official invitation letters for visa purposes ONLY after your registration and your payment has been confirmed.

Registration by email or phone will not be accepted.

Participation of accompanying persons in the various social events of the Conference will be available at an extra cost.

 Before you proceed to registration, read more on the following:

  Ways of Registration

  Payment of Fees

  Cancellation Policy

  Additional Registration Application

  Letters of Invitation

  Personal Insurance

  Registration Hours

Proceed to Registration

On – line Registration

(Your payment will be processed via a secure bank server)

 

Registration Form

(send by fax)

 

Additional Registration Application

(if you wish to add additional items after you finalize your registration - send by fax)

ADVANCE TECHNICAL PROGRAM AVAILABLE
SPECIAL SESSIONS
Special Session 1:
Title: 3D integration: how far are we from the next leap forward in system integration?
Organizers: Trevor Karlson, IMEC, Dr. Antonis Papanikolaou, IMEC
SPECIAL SESSIONS
Special Session 2:
Title: Subthreshold Architectures and Circuits
Organizer: Prof. Yusuf Leblebici, EPFL, Switzerland
Special Session 3:
Title: European-funded Research and Development Projects: Present and Future
Organizers: Dr. Georgi Kuzmanov, TU Delft, Prof. Dimitrios Soudris, NTU Athens
SPECIAL SESSIONS
Special Session 4:
Title: Wearable Electronics
Organizer: Assoc. Professor Annalisa Bonfiglio, University of Cagliari, Italy
KEYNOTE SPEAKERS
Prof. Eby Friedman,
University of Rochester, USA
Prof. Ahmed Jerraya,
CEA/LETI, France
Dr. Roberto Zafalon,
STMicrolectronics, Italy
 
News
call for papers
history
Event Organizers
Event Sponsors
HTCIIntracom
 HSIA
Dimos RodionXanthi